NVIDIA Jetson AGX Orin™ Industrial : MDS테크

: 차세대 산업 애플리케이션을 위한 차세대 AI 성능 탑재

NVIDIA Jetson AGX Orin™ Industrial

더 강력해진 성능
- 15W-75W의 전력으로 구동 가능
  248 TOPs AI 성능 탑재
  AGX Xavier-i 대비 8배 이상의 성능
산업용 AI 제품에 이상적인 모듈
- 동시 AI 애플리케이션 파이프라인 지원
  온도, 작동, 충격 및 진동 사양 확장
  ECC 메모리 지원 및 기타 보안 기능 포함
빠른 시장 진입 가능
- NVIDIA AI 소프트웨어 스택 실행
  활용 사례별 애플리케이션 프레임워크 사용 가능
  NVIDIA Omiverse, TAO Toolkit 등을 통해 개발 시간 절약 가능

차세대 산업 애플리케이션을 위한 차세대 AI 성능 탑재

NVIDIA Jetson AGX Orin™ Industrial

차세대 산업 애플리케이션을 위한 Jetson AGX Orin™ Industrial
새롭게 출시되는 Jetson AGX Orin™ Industrial을 통해 지능형 비디오 분석, 광학검사 그리고 로보틱스 등
까다로운 산업 환경에 완벽한 AI 성능을 탑재해보세요
NVIDIA Jetson AGX Orin™ Industrial Module
CPU 12-core NVIDIA Arm® Cortex A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3
GPU 2048-core NVIDIA Ampere architecture GPU with 64 tensor cores
Memory 64GB 256-bit LPDDR5 @ 3200MHz 204.8GB/s (+ECC)
AI Perf. (INT8) 248 TOPS (INT8)
Power 15w - 75w
Accelerator DL : 2x NVDLA v2.0
Vision : PVA v2.0
Storage 64GB eMMC 5.1
Mechanical 100mm x 87mm
699-pin Connector
NVIDIA Jetson AGX Orin™ Industrial FULL SPEC 바로 가기 지금 구매 하기
Jetson AGX Orin Industrial Module
AI Performance 248 TOPS (INT8)
GPU 2048-core NVIDIA Ampere architecture GPU with 64 tensor cores
Max GPU Freq 1.2 GHz
CPU 12-core NVIDIA Arm® Cortex A78AE v8.2 64-bit CPU
3MB L2 + 6MB L3
CPU Max Freq 2 GHz
DL Accelerator 2x NVDLA v2.0
DLA Max Frequency 1.4 GHz1.6 GHz
Vision Accelerator PVA v2.0
Memory 64GB 256-bit LPDDR5 @ 3200MHz 204.8GB/s (+ECC)
Storage 64GB eMMC 5.1
CSI Camera 16 lanes MIPI CSI-2 (16 virtual channels)
D-PHY 2.1 40Gbps/ C-PHY 2.0 164Gbps
Video Encode 1x 4K60 | 3x 4K30 | 7x 1080p60 | 15x 1080p30 (H.265)
H.264, AV1
Video Decode 1x 8K30 | 3x 4K60 | 7x 4K30 | 11x 1080p60 | 23x 1080p30 (H.265)
H.264, VP9, AV1
Display 1 multi-mode (8K60, 2x 4K60) DP1.4a (+ MST)/HDMI2.1/eDP 1.4
Networking 1 Gbe | 1x 10GBE
USB 3x USB 3.2 Gen 2 | 4x USB 2.0
Other IOs 4x UART 3x SPI | 4x I2S | 8x I2C | 2X CAN | PWM | DMIC | DSPK | GPIOs
Power 15W-75W
Mechanical 100mm x 87mm
699-pin connector

Industrial Features
Mechanical Shock 50G Operational
Vibration 5G Operational
Temperature -40˚C to 85˚C at the TTP Surface
Temperature Endurance -40˚C to 85˚C
Temperature Humidity Biased 85˚C/85% RH
Underfill SoC corner bonding & Component undefill
ECC DRAM ECC supported

	NVIDIA Jetson AGX Orin™ Industrial Module
CPU	12-core NVIDIA Arm® Cortex A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3
GPU	2048-core NVIDIA Ampere architecture GPU with 64 tensor cores
Memory	64GB 256-bit LPDDR5 @ 3200MHz 204.8GB/s (+ECC)
AI Perf. (INT8)	248 TOPS (INT8)
Power	15w - 75w
Accelerator	DL : 2x NVDLA v2.0 Vision : PVA v2.0
Storage	64GB eMMC 5.1
Mechanical	100mm x 87mm 699-pin Connector

	Jetson AGX Orin Industrial Module
AI Performance	248 TOPS (INT8)
GPU	2048-core NVIDIA Ampere architecture GPU with 64 tensor cores
Max GPU Freq	1.2 GHz
CPU	12-core NVIDIA Arm® Cortex A78AE v8.2 64-bit CPU 3MB L2 + 6MB L3
CPU Max Freq	2 GHz
DL Accelerator	2x NVDLA v2.0
DLA Max Frequency	1.4 GHz1.6 GHz
Vision Accelerator	PVA v2.0
Memory	64GB 256-bit LPDDR5 @ 3200MHz 204.8GB/s (+ECC)
Storage	64GB eMMC 5.1
CSI Camera	16 lanes MIPI CSI-2 (16 virtual channels) D-PHY 2.1 40Gbps/ C-PHY 2.0 164Gbps
Video Encode	1x 4K60 \| 3x 4K30 \| 7x 1080p60 \| 15x 1080p30 (H.265) H.264, AV1
Video Decode	1x 8K30 \| 3x 4K60 \| 7x 4K30 \| 11x 1080p60 \| 23x 1080p30 (H.265) H.264, VP9, AV1
Display	1 multi-mode (8K60, 2x 4K60) DP1.4a (+ MST)/HDMI2.1/eDP 1.4
Networking	1 Gbe \| 1x 10GBE
USB	3x USB 3.2 Gen 2 \| 4x USB 2.0
Other IOs	4x UART 3x SPI \| 4x I2S \| 8x I2C \| 2X CAN \| PWM \| DMIC \| DSPK \| GPIOs
Power	15W-75W
Mechanical	100mm x 87mm 699-pin connector
	Industrial Features
Mechanical Shock	50G Operational
Vibration	5G Operational
Temperature	-40˚C to 85˚C at the TTP Surface
Temperature Endurance	-40˚C to 85˚C
Temperature Humidity Biased	85˚C/85% RH
Underfill	SoC corner bonding & Component undefill
ECC	DRAM ECC supported